KYEC My Fab
EN
Equipment Development Development of spare parts and test program Automation Control Vertical Probe Card (VCPC)

The testing equipment designed and manufactured in-house by King Yuan Electronics (KYEC) is currently one of the most cost-effective test platforms and solutions available on the market. It offers the following advantages:

  • Cost-effective, highly efficient, and high-throughput logic testing solutions
  • Open architecture for easy expansion and maintenance
  • Test architectures supporting operating frequencies of 200 MHz and above
  • User-friendly test program development and coding environment
  • Compact footprint: 820 mm (L) x 660 mm (W) x 400 mm (H)

Our proprietary equipment solutions offer a uniquely differentiated, professional outsourced testing service to the global semiconductor industry. This significantly reduces our customers' overall test expenditures, enabling a faster time-to-market while securing a highly competitive cost advantage.

KYEC’s proprietary test platforms achieve comprehensive integration across equipment performance, mechanical interfaces, and system programming. Beyond maintaining a leading technological edge, we have further integrated the manufacturing technologies for all critical machine components and spare parts, alongside continuous innovation in hardware and software interface development. This comprehensive testing solution significantly boosts production efficiency and throughput while delivering exceptional compatibility (flexibility) and scalability (customization).

Currently, KYEC’s in-house developed test platforms have evolved from their initial applications—logic and analog test modules designed for testing mixed-signal devices, power management ICs (PMIC), and radio frequency (RF) components. The application scope has now expanded into the development of high-speed test module mechanisms (e.g., MEMS G/P sensors and CMOS image sensor modules) as well as the design and development of critical technologies and components. This includes proprietary Strip Handler manufacturing technologies and the design and development of VCPC advanced test circuit boards. Moving forward, KYEC will continue to deepen its technical expertise to provide comprehensive logic IC testing technologies.

Burn-In Test History Categories of application Mass production products Convertible platforms Existing testing platforms

KYEC Burn-in system

As the AI industry rapidly advances, the power consumption of AI GPUs, AI accelerators, High Bandwidth Memory (HBM), and advanced packaging continues to rise significantly. Consequently, the burn-in process has evolved from traditional reliability screening into a highly critical phase of AI chip mass production. Having deeply cultivated this field for many years, King Yuan Electronics (KYEC) continues to drive innovation.

Leveraging our extensive R&D experience in proprietary automated equipment, we have consistently upgraded our Burn-In systems' power delivery capabilities. Our platforms have evolved from the HP600, which provides 1,000 watts of DC power, to the HPII 600 with 2,000 watts, culminating in the 2024 launch of the HPIII 600 Burn-In system, capable of delivering 3,000 watts of DC power.

Looking ahead to 2025, KYEC is revolutionizing the architecture by injecting Automated Test Equipment (ATE) concepts directly into the Burn-In system. By integrating modularized functional test boards into the burn-in environment, we have developed the HP320—a hybrid platform that features both high-power burn-in and robust testing capabilities. The HP320 offers deeper test pattern memory capacity and a comprehensive suite of debugging tools, even enabling customers to shift certain Final Test (FT) items to be executed directly on the HP320 platform.

In Burn-In systems, thermal control technology has evolved from early fans and heat pipes to advanced cold plates in 2026. Thermal dissipation capacity has similarly expanded from 150W with fan cooling and 1,500W with heat pipes to over 1,500W with liquid cooling, delivering a comprehensive suite of thermal management solutions to the industry.

Furthermore, King Yuan Electronics (KYEC) has once again integrated smart factory principles into the burn-in mass production workflow. In 2026, KYEC introduced the KYEC Intelligence Test System (KITS), featuring a fully automated production architecture. KITS seamlessly integrates various manufacturing units—including Loader Tray Racks, Loader Sorters, Automated Guided Vehicles (AGVs), Robotic Arms, Unloader Sorters, and Unloader Trays—to achieve optimal operational efficiency.

KYEC also leverages extensive design expertise and robust supply chain partnerships across related Burn-In Boards (BIBs), hardware accessories, custom components, and thermal interface media. This enables us to provide complete, end-to-end turnkey solutions, allowing customers to focus their efforts on product development and market expansion.

Tailored to meet diverse customer specifications, KYEC’s proprietary Burn-In system portfolio offers a wide selection of models, including HP300, HP320, HP320-HV, HP384, HP500, HP600, as well as the smart-factory-integrated KITS HP300_Q, KITS HP520_Q, and KITS HP600_Q.

Sorry, this website does not support browsers below IE10.