King Yuan Electronics (KYEC) has successfully developed and mass-produced Vertical Probe Cards. In terms of both fine pitch and pin count, this cutting-edge technology rivals current mainstream products on the market while delivering superior performance. Vertical probe cards overcome the inherent drawbacks of traditional cantilever probe cards, such as probe burn-out caused by insufficient current carrying capacity (CCC) and test instability associated with high pin counts.
Backed by our proprietary, in-house technology for the development and manufacturing of vertical probe cards, KYEC can significantly reduce manufacturing costs compared to current industry standards. This provides our customers with unparalleled advantages in both testing cost reduction and production efficiency.
Currently, advanced Mobile SoC packaging predominantly utilizes the Copper Pillar process for I/O signal contacts. As a result, wafers equipped with copper pillars have become the mainstream in wafer testing in recent years. The advantages of vertical probe cards are particularly prominent in post-bumping wafer testing, especially for products requiring high pin counts or high current. Offering superior overall performance, rapid maintenance, and reduced testing complexity (such as minimizing site unbalance and crosstalk), vertical probe cards are highly capable of testing high-speed signals. We have already successfully implemented 56Gbps loopback testing in mass production within the CP (Chip Probe) environment.
KYEC has successfully accumulated mass production experience in developing vertical probe cards with a minimum pitch of 50 μm. Across diverse product lines, our probe card solutions demonstrate robust in-house manufacturing capabilities and proven production experience for both 50 μm pitch Al-pad CUP (Circuit Under Pad) products and Copper Pillar Bump products with a pitch of 75 μm and above. Furthermore, for the development of high-pin-count logic devices (min. pitch > 75 μm), we utilize MEMS probe solutions, where we have also achieved substantial development milestones and accumulated significant experience.

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