Package Service
KYEC provides an eMMC/eMCP package that complies with JEDEC eMMC 4.5/5.0/5.1. The internal structure of eMMC (embedded Multimedia Card) is composed of NAND flash non-volatile memory and NAND flash controller (Controller). The eMCP embedded Multi Chip Package integrates eMMC (NAND flash and its control chip) with low power mobile memory (Low Power DDR3/DDR4) into a BGA package.
This package type is smaller in size, large in storage capacity and low in power consumption. It is used in many consumer electronic devices, such as: smart phones, tablets, wearable devices, car infotainment systems, digital set-top boxes. , smart networked TV, etc.
Features
- Gold wire & Copper Wire Capability
- Turnkey Service
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Package types |
Package dimension (Width x Length x Height) |
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eMMC 91 |
12 mm x 24 mm x 1.4 mm |
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eMMC 100 |
14 mm x 18 mm x 1.2 mm |
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eMMC 132 |
12 mm x 16 mm x 1.2 mm |
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eMMC 145 |
11.5 mm x 13 mm x 1.4 mm |
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eMMC 153 |
11.5 mm x 13 mm x 1.0 mm |
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eMMC 169 |
14 mm × 18 mm × 1.2 mm |
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MCP 156 |
20 mm x 16 mm x 1.4 mm |
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MCP 162 |
11.5 mm x 13 mm x 1.0 mm |
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eMCP 162 |
11.5 mm x 13 mm x 1.0 mm |
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eMCP 221 |
11.5 mm x 13 mm x 1.0 mm |