The TSOP package is mainly used for the protection of DRAM and flash memory products. The TSOP package include TSOP I and TSOP II. The main difference between the two package types is the position of the pins. Pins of TSOP I are located on the short side of the product, as shown in the upper left figure, While pins of TSOP II are located on the long side of the product, as shown in the center and upper right picture. KYEC has a powerful memory product testing capability that provides a one-stop solution for the client. Packages in volume production include TSOP I 48L, TSOP II 50L, TSOP II 54L, TSOP II 66L.