KYEC is also the memory card subcontractor, offering a set of processing services such as substrate design, packaging, and testing for various types of products including SD/Micro SD, UFD2.0/3.0, UDP/Mini UDP 2.0/3.0, Mini SIM, Micro SIM, HSSD, FSD and eMMC/eMCP. The assembly of the memory card usually integrates one or more NAND flash and controller IC chips into a module, use traditional package with the latest technology for memory card packaging. And test the memory card capacity and speed through the test equipment.
Package types |
Package dimension (Width x Length) |
Mini SDP |
17.2 mm x 33.4 mm |
FSD 3.0 |
24 mm x 32 mm |
UDP 2.0 |
11.3 mm × 24.8 mm |
Mini UDP 2.0 |
11.3 mm × 15 mm |
UDP 3.0 |
11.3 mm × 24.8 mm |
Mini UDP 3.0 |
11.3 mm × 15 mm |
UDP 2.0 + OTG |
11.3 mm × 24.8 mm |
Mini UDP 2.0 + OTG |
11.3 mm × 15 mm |
UDP 3.0 + OTG |
11.3 × 24.8 mm |
Mini UDP 3.0 + OTG |
11.3 × 15 mm |
Mini UDP 2.0 + Type C |
11.3 mm × 15 mm |
Mini UDP 3.0 + Type C |
11.3 mm × 15 mm |
USB COB |
11.3 mm × 24.8 mm |
Mini SIM Card |
15 mm × 25 mm |
Micro SIM Card |
12 mm × 15 mm |
Nano SIM Card |
8.8 mm × 12.3 mm |
Mini SIM Card + RF Application |
15 mm × 25 mm |
Micro SIM Card + RF Application |
12 mm × 15 mm |
Nano SIM Card + RF Application |
8.8 mm × 12.3 mm |
Sim T-Card |
11 mm × 15 mm |
HSSD 11 |
11 mm × 21.5 mm |
HSSD 14 |
14 mm × 21.5 mm |
HSSD 17 |
17 mm × 21.5 mm |
HSSD 29 |
29 mm × 21.5 mm |
HSSD 14 4.0 |
14 mm × 21 mm |
HSSD 17 4.0 |
17 mm × 21 mm |
HSSD 29 4.0 |
29 mm × 21 mm |
Micro SD 2.0 |
11 mm × 15 mm |
Micro SD 3.0 |
11 mm × 15 mm |
Smart Micro SD |
11 mm × 15 mm |
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