Package Service
KYEC can produce LGA packages of various sizes from 1.3 mm × 1.3 mm up to 21 mm × 32 mm. The LGA package can accommodate more input and output pins in a smaller size, reducing the area occupied by the motherboard, reducing parasitic electrical characteristics and reducing the overall package height. This package type is suitable for Radio Frequency (RF) components of wireless communication and micro electro mechanical systems (MEMS) sensors, etc.
LGA-RF
LGA 9.0 mm x 9.0 mm 64LFeatures
- Small form factor and light weight
- Passive component optional
- Turnkey Service
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Package types |
Package dimension (Width x Length x Height) |
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LGA 4 |
1.3 mm x 1.3 mm x 1.35 mm |
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LGA 6 |
1.6 mm x 1.6 mm x 0.8 mm |
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LGA 8 |
6.0 mm x 8.0 mm x 1.0 mm |
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LGA 24 |
3.45 mm x 3.45 mm x 1.2 mm |
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LGA 32 |
11 mm x 11 mm x 1.1 mm |
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LGA 44 |
10 mm x 10 mm x 1.3 mm |
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LGA 48 |
21.5 mm x 32 mm x 1.4 mm |
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LGA 51 |
3.0 mm x 7.6 mm x 1.0 mm |
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LGA 52L |
14 mm × 18 mm × 1.0 mm |
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LGA 56 |
10 mm x 10 mm x 1.0 mm |
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LGA 60 |
14 mm x 18 mm x 1.0 mm |
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LGA 66 |
3.9 mm x 9.1 mm x 0.75 mm |
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LGA 73 |
17 mm x 17 mm x 1.4 mm |
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LGA 139 |
11 mm x 15 mm x 0.8 mm |
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LGA 156 |
12 mm x 12 mm x 0.75 mm |