封裝服務
京元電子提供各樣式的BGA封裝型式，包括：LFBGA (Low Profile Fine-Pitch BGA)、TFBGA (Thin Fine-Pitch BGA) 和Mini-BGA。
BGA封裝型式:
一站式封裝服務，包含以下封裝尺寸：
|
封 裝 形 式 |
尺 寸 (寬 x 長 x 高) |
|
LFBGA 132 |
12 mm x 18 mm x 1.0 mm |
|
LFBGA 152 |
14 mm x 18 mm x 1.0 mm |
|
LFBGA 168 |
12 mm x 12 mm x 1.0 mm |
|
LFBGA 178 |
10.5 mm x 11.5 mm x 1.0 mm / 11 mm x 11.5 mm x 1.0 mm |
|
LFBGA 200 |
10 mm x 14.5 mm x 1.0 mm |
|
LFBGA 272 |
14 mm x 18 mm x 1.0 mm |
|
LFBGA 361 |
13 mm x 13 mm x 1.3 mm |
|
LFBGA 400 |
14 mm x 14 mm x 1.5 mm |
|
TFBGA 71 |
5 mm x 6 mm x 1.2 mm |
|
TFBGA 100 |
12 mm x 18 mm x 1.25 mm |
|
TFBGA 152 |
14 mm x 18 mm x 1.0 mm |
|
TFBGA 180 |
12 mm x 12 mm x 1.3 mm |
|
TFBGA 272 |
12 mm x 18 mm x 1.35 mm |
|
TFBGA 304 |
13 mm x 13 mm x 1.2 mm |
|
Mini BGA 48 |
6 mm x 8 mm x 1.2 mm |